Xilinx Announces New Applications with Cost-Optimized UltraScale+ Portfolio for Ultra-Compact, High-Performance Edge Compute

Xilinx, Inc., (NASDAQ: XLNX), the pioneer in adaptive computing, today announced the organization has expanded its UltraScale+™ portfolio for business sectors with new applications that require ultra-compact and keen edge arrangements. With structure factors that are 70% more modest than customary chip-scale bundling, the new Artix® and Zynq® UltraScale+ gadgets would now be able to address a more extensive scope of applications inside the modern, vision, medical care, broadcast, purchaser, auto, and systems administration markets.

As the world's just equipment versatile expense advanced portfolio dependent on 16 nanometer innovation, Artix and Zynq UltraScale+ gadgets are accessible in TSMC's best in class InFO (Integrated Fan-Out) bundling innovation. Utilizing InFO, Artix and Zynq UltraScale+ gadgets address the issue for savvy edge applications by conveying high-process thickness, execution per-watt, and adaptability in compact bundling alternatives.

“Demand for compact, intelligent edge applications is driving the requirement for processing and bandwidth engines to not only provide higher performance, but also new levels of compute density to enable the smallest form factor systems,” said Sumit Shah, senior director, Product Line Management and Marketing at Xilinx. “The new cost-optimized additions to our UltraScale+ portfolio are powerful enhancements that leverage the architecture and production-proven technology of Xilinx’s UltraScale+ FPGAs and MPSoCs, which collectively have been deployed in millions of systems worldwide.”

Artix UltraScale+ FPGAs: Built for High I/O Bandwidth and DSP Compute

The Artix UltraScale+ family is based on its creation demonstrated FPGA engineering and is ideal for a scope of applications incorporating machine vision with cutting edge sensor innovation, high velocity organizing, and ultra-compact "8K-prepared" video broadcasting. Artix UltraScale+ gadgets convey 16 gigabits-per-second handsets to help arising and progressed conventions in systems administration, vision, and video, while likewise conveying the most elevated DSP register in its group.

Zynq UltraScale+ MPSoCs: Optimized for Power and Cost

Cost-upgraded Zynq UltraScale+ MPSoCs incorporate the new ZU1 and creation demonstrated ZU2 and ZU3 gadgets, all accessible in InFO bundling. As a feature of the multiprocessing SoC line from the Zynq UltraScale+ family, ZU1 is intended for network at the edge and for mechanical and medical services IoT frameworks, including installed vision cameras, AV-over-IP 4K and 8K-prepared streaming, hand-held test gear, just as shopper and clinical applications. ZU1 is worked for scaled down figure concentrated applications and fueled by a heterogeneous Arm® processor-based multicore processor subsystem, while additionally having the option to relocate to regular bundle impressions for more noteworthy register.

“LUCID has worked closely with Xilinx to integrate the new UltraScale+ ZU3 into our next generation industrial machine vision camera, the Triton Edge,” said Rod Barman, founder and president at LUCID Vision Labs. “With the UltraScale+ ZU3 and its InFO packaging, LUCID was able to utilize an innovative rigid-flex board architecture to squeeze an amazing amount of processing power into an ultra-compact IP67, factory-tough camera.”

Artix and Zynq UltraScale+ are Scalable and Secure

With the expansion of Artix gadgets and the augmentation to the Zynq UltraScale+ family, Xilinx's portfolio currently ranges across the very good quality with Virtex® UltraScale+, to the midrange with Kintex® UltraScale+, to the new expense streamlined low-end. These new gadgets balance the portfolio and give adaptability to clients to build up different arrangements utilizing a similar Xilinx stage. This jelly plan speculations across the portfolio and velocities time-to-showcase.

Security is a basic segment in Xilinx plans, and both expense streamlined Artix and Zynq UltraScale+ families incorporate a similar strong security highlights found across the UltraScale+ portfolio. Included are RSA-4096 validation, AES-CGM decoding, DPA countermeasures, and Xilinx's exclusive Security Monitor IP that adjusts to security dangers across the item life cycle, meeting the security needs for both safeguard and business projects.

“The ability for customers to scale their designs using a single secure platform for a wide range of applications and markets is key to enabling faster, easier design integration as well as for capturing critical time-to-market opportunities,” said Dan Mandell, senior analyst, IoT and Embedded Technology at VDC Research. “Xilinx’s strategy to expand its portfolio to meet these market needs with its scalable and secure UltraScale+ Artix and Zynq families is compelling, especially considering the strong business opportunities in growth markets where these solutions are being deployed.”

Availability

The previously cost-upgraded Artix UltraScale+ gadgets are required to be accessible underway by Q3 CY2021, with Vivado® Design Suite and Vitis™ Unified Software Platform device uphold beginning pre-fall. Zynq UltraScale+ ZU1 gadgets will likewise start testing in Q3 with apparatus uphold in Q2, and volume creation of the all-inclusive portfolio starting Q4.

About Xilinx

Xilinx, Inc. develops highly flexible and adaptive processing platforms that enable rapid innovation across a variety of technologies - from the cloud, to the edge, to the endpoint. Xilinx is the inventor of the FPGA and Adaptive SoCs (including our Adaptive Compute Acceleration Platform, or ACAP), designed to deliver the most dynamic computing technology in the industry. We collaborate with our customers to create scalable, differentiated and intelligent solutions that enable the adaptable, intelligent and connected world of the future.